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Layer Count:32L
Material:TU-768
Board Thickness:4.75±0.25mm
Min.Trace/Space:3.9/3.9mil
Min Pitch Size:0.4mm
Micro vias:L1-L2,L31-L32
Blind vias:L2-L31
Min.Hole Size:0.2mm
Aspect Ratio:24:1
Flatness:≤0.25%
Install Pemnut:4
Layer Count:32L
Material:TU-768
Board Thickness:4.75±0.25mm
Min.Trace/Space:3.9/3.9mil
Min Pitch Size:0.4mm
Micro vias:L1-L2,L31-L32
Blind vias:L2-L31
Min.Hole Size:0.2mm
Aspect Ratio:24:1
Flatness:≤0.25%
Install Pemnut:4