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| Item | Advantages | definition |
Glass through hole relative to silicon through hole | Excellent high-frequency electrical properties | Glass material is an insulator material with a dielectric constant of only about 13 of that of silicon material, and a loss factor 2-3 orders of magnitude lower than that of silicon material, which greatly reduces substrate loss and parasitic effects, ensuring the integrity of the transmitted signal |
| Large-size ultra-thin glass substrates are easily available | Glass manufacturers such as Corning, Asahi and SCHOTT can provide ultra-large-size (>2mx2m) and ultra-thin (<50ym) panel glass and ultra-thin flexible glass materials | |
| Low cost | Benefiting from the easy availability of large-size ultra-thin panel glass and the lack of the need to deposit an insulating layer, the production cost of a glass adapter is only about 1/8 of that of a silicon-based adapter | |
| Simple process flow | No insulating layer needs to be deposited on the substrate surface and the inner wall of the TGV, and no thinning is required in the ultra-thin adapter | |
| Strong mechanical stability | Even when the thickness of the adapter is less than 100pm, the warping is still small |
Selling Points:
Advanced Packaging Technology: The GCS System-In-Package utilizes the latest in thin glass substrate technology, providing a sophisticated solution for high-density packaging requirements in fused quartz panels.
High-Performance Materials: Crafted from premium thin glass, the substrate offers exceptional electrical insulation and thermal conductivity, which are crucial for maintaining the integrity and performance of the fused quartz panels.
Enhanced Signal Integrity: The thin glass substrate design minimizes signal loss and crosstalk, ensuring clear and accurate data transmission within the fused quartz panels, which is essential for high-frequency applications.
Customizable Dimensions: Available in a variety of sizes and thicknesses, the GCS System-In-Package can be tailored to fit the specific needs of different fused quartz panel applications, from semiconductor manufacturing to high-precision instruments.
Robust Mechanical Strength: The substrate's glass composition provides high mechanical strength, making it resistant to breakage and suitable for use in demanding environments where durability is key.
Optimized for High-Frequency Applications: Engineered to support high-frequency operations, the GCS System-In-Package is ideal for applications such as telecommunications, radar systems, and advanced computing where signal speed and accuracy are paramount.
Thermal Management: The thin glass substrate's thermal properties contribute to effective heat dissipation in the fused quartz panels, preventing overheating and prolonging the life of the components.
Compatibility with Advanced Processes: Designed to be compatible with the latest semiconductor processing techniques, including 3D integration and through-silicon via (TSV) technology, the GCS System-In-Package is at the forefront of microelectronics innovation.
Reliability and Longevity: The use of high-quality materials and advanced manufacturing processes ensures the GCS System-In-Package offers long-term reliability and a reduced risk of failure, even in the most challenging conditions.
Environmental Stability: The substrate is designed to operate effectively across a wide range of temperatures and environments, making it suitable for both indoor and outdoor applications.
| Item | Advantages | definition |
Glass through hole relative to silicon through hole | Excellent high-frequency electrical properties | Glass material is an insulator material with a dielectric constant of only about 13 of that of silicon material, and a loss factor 2-3 orders of magnitude lower than that of silicon material, which greatly reduces substrate loss and parasitic effects, ensuring the integrity of the transmitted signal |
| Large-size ultra-thin glass substrates are easily available | Glass manufacturers such as Corning, Asahi and SCHOTT can provide ultra-large-size (>2mx2m) and ultra-thin (<50ym) panel glass and ultra-thin flexible glass materials | |
| Low cost | Benefiting from the easy availability of large-size ultra-thin panel glass and the lack of the need to deposit an insulating layer, the production cost of a glass adapter is only about 1/8 of that of a silicon-based adapter | |
| Simple process flow | No insulating layer needs to be deposited on the substrate surface and the inner wall of the TGV, and no thinning is required in the ultra-thin adapter | |
| Strong mechanical stability | Even when the thickness of the adapter is less than 100pm, the warping is still small |
Selling Points:
Advanced Packaging Technology: The GCS System-In-Package utilizes the latest in thin glass substrate technology, providing a sophisticated solution for high-density packaging requirements in fused quartz panels.
High-Performance Materials: Crafted from premium thin glass, the substrate offers exceptional electrical insulation and thermal conductivity, which are crucial for maintaining the integrity and performance of the fused quartz panels.
Enhanced Signal Integrity: The thin glass substrate design minimizes signal loss and crosstalk, ensuring clear and accurate data transmission within the fused quartz panels, which is essential for high-frequency applications.
Customizable Dimensions: Available in a variety of sizes and thicknesses, the GCS System-In-Package can be tailored to fit the specific needs of different fused quartz panel applications, from semiconductor manufacturing to high-precision instruments.
Robust Mechanical Strength: The substrate's glass composition provides high mechanical strength, making it resistant to breakage and suitable for use in demanding environments where durability is key.
Optimized for High-Frequency Applications: Engineered to support high-frequency operations, the GCS System-In-Package is ideal for applications such as telecommunications, radar systems, and advanced computing where signal speed and accuracy are paramount.
Thermal Management: The thin glass substrate's thermal properties contribute to effective heat dissipation in the fused quartz panels, preventing overheating and prolonging the life of the components.
Compatibility with Advanced Processes: Designed to be compatible with the latest semiconductor processing techniques, including 3D integration and through-silicon via (TSV) technology, the GCS System-In-Package is at the forefront of microelectronics innovation.
Reliability and Longevity: The use of high-quality materials and advanced manufacturing processes ensures the GCS System-In-Package offers long-term reliability and a reduced risk of failure, even in the most challenging conditions.
Environmental Stability: The substrate is designed to operate effectively across a wide range of temperatures and environments, making it suitable for both indoor and outdoor applications.
