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Selling Points:
High Transparency and Opaqueness: The product offers a unique balance of transparency for light transmission and opaqueness for light blocking, which is crucial for certain chip packaging applications.
ITO Coating: Incorporating Indium Tin Oxide (ITO) provides excellent electrical conductivity and transparency, making it ideal for touch screen applications and other electronic devices.
High Thermal Stability: Quartz substrates are known for their ability to withstand high temperatures without significant degradation, ensuring long-term reliability.
Chemical Resistance: The material is resistant to most chemicals, making it suitable for harsh environments and various industrial applications.
High Mechanical Strength: The quartz plate offers superior hardness and durability, reducing the risk of damage during handling and use.
Customizable Dimensions: Available in a range of sizes and shapes to fit specific chip packaging requirements.
Optimized for High-Frequency Applications: The material's low dielectric constant and high-frequency response make it suitable for advanced chip packages.
Specifications:
Material: Opaque Quartz Plate with ITO Glass Substrate
Thickness: Customizable (e.g., 0.5mm, 1.0mm, 1.5mm)
Size: Customizable to fit chip package dimensions
ITO Coating: Thickness and sheet resistance customizable (e.g., 100-200 nm thickness, 10-50 ohms/sq resistance)
Surface Roughness: Typically less than 10 nm Ra
Transmittance: High transparency in the visible light range, with adjustable opaqueness
Thermal Stability: Operable in a wide temperature range, typically -60°C to 300°C
Mechanical Strength: High hardness and tensile strength
Chemical Resistance: Resistant to acids, alkalis, and organic solvents
Material Features:
Quartz Substrate:
High purity quartz provides excellent light transmission characteristics.
Low thermal expansion coefficient for stable performance over temperature changes.
High chemical inertness for durability in various environments.
ITO Coating:
Provides a conductive layer that is transparent to visible light.
Enables the product to be used in capacitive touch technologies.
Enhances the product's functionality in electronic devices.
Opaqueness:
Controlled light blocking properties for applications requiring light management.
Can be tailored to specific requirements for light transmission and blocking.
Customizability:
The product can be customized to meet the exact needs of chip packaging, including size, shape, and coating specifications.
Environmental Stability:
Suitable for use in environments with varying humidity and temperature conditions.
Resistant to degradation from UV light and other environmental factors.
This Opaque Quartz Plate ITO Glass Substrate Front Component for Chip Package is designed to meet the stringent requirements of the semiconductor industry, offering a combination of high performance, durability, and customization to ensure optimal performance in chip packaging applications.
Selling Points:
High Transparency and Opaqueness: The product offers a unique balance of transparency for light transmission and opaqueness for light blocking, which is crucial for certain chip packaging applications.
ITO Coating: Incorporating Indium Tin Oxide (ITO) provides excellent electrical conductivity and transparency, making it ideal for touch screen applications and other electronic devices.
High Thermal Stability: Quartz substrates are known for their ability to withstand high temperatures without significant degradation, ensuring long-term reliability.
Chemical Resistance: The material is resistant to most chemicals, making it suitable for harsh environments and various industrial applications.
High Mechanical Strength: The quartz plate offers superior hardness and durability, reducing the risk of damage during handling and use.
Customizable Dimensions: Available in a range of sizes and shapes to fit specific chip packaging requirements.
Optimized for High-Frequency Applications: The material's low dielectric constant and high-frequency response make it suitable for advanced chip packages.
Specifications:
Material: Opaque Quartz Plate with ITO Glass Substrate
Thickness: Customizable (e.g., 0.5mm, 1.0mm, 1.5mm)
Size: Customizable to fit chip package dimensions
ITO Coating: Thickness and sheet resistance customizable (e.g., 100-200 nm thickness, 10-50 ohms/sq resistance)
Surface Roughness: Typically less than 10 nm Ra
Transmittance: High transparency in the visible light range, with adjustable opaqueness
Thermal Stability: Operable in a wide temperature range, typically -60°C to 300°C
Mechanical Strength: High hardness and tensile strength
Chemical Resistance: Resistant to acids, alkalis, and organic solvents
Material Features:
Quartz Substrate:
High purity quartz provides excellent light transmission characteristics.
Low thermal expansion coefficient for stable performance over temperature changes.
High chemical inertness for durability in various environments.
ITO Coating:
Provides a conductive layer that is transparent to visible light.
Enables the product to be used in capacitive touch technologies.
Enhances the product's functionality in electronic devices.
Opaqueness:
Controlled light blocking properties for applications requiring light management.
Can be tailored to specific requirements for light transmission and blocking.
Customizability:
The product can be customized to meet the exact needs of chip packaging, including size, shape, and coating specifications.
Environmental Stability:
Suitable for use in environments with varying humidity and temperature conditions.
Resistant to degradation from UV light and other environmental factors.
This Opaque Quartz Plate ITO Glass Substrate Front Component for Chip Package is designed to meet the stringent requirements of the semiconductor industry, offering a combination of high performance, durability, and customization to ensure optimal performance in chip packaging applications.
