loading
| Availability: | |
|---|---|
| Quantity: | |
Product Description:The High Performance Computing (HPC) Epoxy Glass Substrate PCB & PCBA Product is a cutting-edge solution designed for demanding computing applications that require high-speed data processing and transmission. This product utilizes an epoxy glass substrate, which is known for its excellent electrical insulation properties and thermal stability, making it ideal for high-frequency and high-power applications.
Key Features:
High-speed signal transmission capabilities
Enhanced thermal conductivity for better heat dissipation
Superior electrical insulation for reliable performance
Robust mechanical strength for durability in harsh environments
Fine-line routing for dense component placement
Compliance with IPC standards for quality assurance
Specifications:
Material: Epoxy Glass Substrate
Layer Count: 2-32 layers (customizable)
Trace Width: 3 mils minimum (customizable)
Trace Spacing: 3 mils minimum (customizable)
Board Thickness: 0.8mm - 3.2mm (customizable)
Surface Finish: ENIG, HASL, Immersion Gold, etc.
Copper Weight: 1 oz/ft² to 3 oz/ft² (customizable)
Tolerance: ±0.1mm for dimensions, ±0.05mm for hole diameter
Operating Temperature: -40°C to 125°C
Moisture Resistance: IPC-4101 Class 2 compliant
Application Scenarios:
Data Centers: For servers and storage systems that require high-speed data processing and transmission.
Supercomputers: In high-performance computing clusters for scientific research and complex simulations.
AI and Machine Learning: For hardware accelerators and neural network processors.
Telecommunications: In base stations and network equipment for high-frequency signal processing.
Automotive Electronics: For advanced driver assistance systems (ADAS) and infotainment systems in vehicles.
Industrial Automation: For control systems and sensors in manufacturing and process automation.
Military and Aerospace: For radar systems, avionics, and other high-reliability applications.
Customization Options:
Custom board shapes and sizes
Flexible PCB design to accommodate unique component layouts
Tailored materials and finishes to meet specific performance requirements
Certifications and Compliance:
ISO 9001:2015 for quality management systems
IPC-A-600G for PCB acceptance requirements
REACH and RoHS compliance for environmental standards
Product Description:The High Performance Computing (HPC) Epoxy Glass Substrate PCB & PCBA Product is a cutting-edge solution designed for demanding computing applications that require high-speed data processing and transmission. This product utilizes an epoxy glass substrate, which is known for its excellent electrical insulation properties and thermal stability, making it ideal for high-frequency and high-power applications.
Key Features:
High-speed signal transmission capabilities
Enhanced thermal conductivity for better heat dissipation
Superior electrical insulation for reliable performance
Robust mechanical strength for durability in harsh environments
Fine-line routing for dense component placement
Compliance with IPC standards for quality assurance
Specifications:
Material: Epoxy Glass Substrate
Layer Count: 2-32 layers (customizable)
Trace Width: 3 mils minimum (customizable)
Trace Spacing: 3 mils minimum (customizable)
Board Thickness: 0.8mm - 3.2mm (customizable)
Surface Finish: ENIG, HASL, Immersion Gold, etc.
Copper Weight: 1 oz/ft² to 3 oz/ft² (customizable)
Tolerance: ±0.1mm for dimensions, ±0.05mm for hole diameter
Operating Temperature: -40°C to 125°C
Moisture Resistance: IPC-4101 Class 2 compliant
Application Scenarios:
Data Centers: For servers and storage systems that require high-speed data processing and transmission.
Supercomputers: In high-performance computing clusters for scientific research and complex simulations.
AI and Machine Learning: For hardware accelerators and neural network processors.
Telecommunications: In base stations and network equipment for high-frequency signal processing.
Automotive Electronics: For advanced driver assistance systems (ADAS) and infotainment systems in vehicles.
Industrial Automation: For control systems and sensors in manufacturing and process automation.
Military and Aerospace: For radar systems, avionics, and other high-reliability applications.
Customization Options:
Custom board shapes and sizes
Flexible PCB design to accommodate unique component layouts
Tailored materials and finishes to meet specific performance requirements
Certifications and Compliance:
ISO 9001:2015 for quality management systems
IPC-A-600G for PCB acceptance requirements
REACH and RoHS compliance for environmental standards
