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Layer Count:22L
Material:TU-883
Board Thickness:3.2mm±0.2mm
Min.Trace/Space:3/3mil
Copper Type: HVLP
Via-in-Pad:VIPPO
Back Drill:12 sets
Impedance:20 lines
Layer Count:22L
Material:TU-883
Board Thickness:3.2mm±0.2mm
Min.Trace/Space:3/3mil
Copper Type: HVLP
Via-in-Pad:VIPPO
Back Drill:12 sets
Impedance:20 lines