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Advantages of glass substrate:
①They can be made very flat, resulting in finer patterns and higher (10 times) interconnect densities. During the lithography process, the entire substrate is evenly exposed, thus reducing defects.
②The glass and the silicon chip above it have a similar coefficient of thermal expansion, which reduces the thermal stress.
③The glass substrate does not warp and is able to accommodate higher chip densities in a single package. The initial prototype was able to handle 50% more chip density than the organic substrate.
④Optical interconnection can be seamlessly integrated to promote more efficient co-packaging optics.
⑤ Usually rectangular wafers, increasing the number of chips per wafer, improving yield and reducing costs
Why glass substrate?
Glass as a material is widely studied and integrated in multiple semiconductor industries, and this trend represents a significant development in the selection of advanced packaging materials. Glass has several advantages over organic and ceramic materials.
Unlike organic substrates, which have been the dominant technology for many years, glass has excellent dimensional stability, thermal conductivity and electrical properties. The glass substrate, combined with the wiring layer above and below and other auxiliary materials, is jointly made of the substrate, which can perfectly solve the many shortcomings of the current organic substrate. In addition, the glass substrate provides engineers with greater design flexibility, allowing inductors and capacitors to be embedded into the glass for better power supply solutions and lower power consumption.
The advantages of glass substrate are as follows:
* The glass substrate can be made very flat for finer patterning, which can reduce pattern distortion by 50% and higher (10 times) wiring density. During lithography, the entire substrate is evenly exposed, thus reducing defects.
* The coefficient of thermal expansion of the glass is similar to that of the silicon chip above, which can reduce thermal stress.
* Does not warp and can handle higher density chips in a single package. The initial prototype can handle chip densities 50 percent higher than organic substrates.
Optical interconnects can be seamlessly integrated, resulting in more efficient co-packaged optics.
* These substrates are usually rectangular wafers, increasing the number of chips per wafer, increasing production and reducing costs.
Glass substrates have the potential to replace in-package organic substrates, silicon intermediate layers, and other high-speed embedded interconnect devices.
Advantages of glass substrate:
①They can be made very flat, resulting in finer patterns and higher (10 times) interconnect densities. During the lithography process, the entire substrate is evenly exposed, thus reducing defects.
②The glass and the silicon chip above it have a similar coefficient of thermal expansion, which reduces the thermal stress.
③The glass substrate does not warp and is able to accommodate higher chip densities in a single package. The initial prototype was able to handle 50% more chip density than the organic substrate.
④Optical interconnection can be seamlessly integrated to promote more efficient co-packaging optics.
⑤ Usually rectangular wafers, increasing the number of chips per wafer, improving yield and reducing costs
Why glass substrate?
Glass as a material is widely studied and integrated in multiple semiconductor industries, and this trend represents a significant development in the selection of advanced packaging materials. Glass has several advantages over organic and ceramic materials.
Unlike organic substrates, which have been the dominant technology for many years, glass has excellent dimensional stability, thermal conductivity and electrical properties. The glass substrate, combined with the wiring layer above and below and other auxiliary materials, is jointly made of the substrate, which can perfectly solve the many shortcomings of the current organic substrate. In addition, the glass substrate provides engineers with greater design flexibility, allowing inductors and capacitors to be embedded into the glass for better power supply solutions and lower power consumption.
The advantages of glass substrate are as follows:
* The glass substrate can be made very flat for finer patterning, which can reduce pattern distortion by 50% and higher (10 times) wiring density. During lithography, the entire substrate is evenly exposed, thus reducing defects.
* The coefficient of thermal expansion of the glass is similar to that of the silicon chip above, which can reduce thermal stress.
* Does not warp and can handle higher density chips in a single package. The initial prototype can handle chip densities 50 percent higher than organic substrates.
Optical interconnects can be seamlessly integrated, resulting in more efficient co-packaged optics.
* These substrates are usually rectangular wafers, increasing the number of chips per wafer, increasing production and reducing costs.
Glass substrates have the potential to replace in-package organic substrates, silicon intermediate layers, and other high-speed embedded interconnect devices.
