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Glass substrate
Recently, the company said that the supply chain for GB200DGXIMGX, the advanced packaging process used in the GB200, which will use glass substrates, has been started.
Glass substrates can form finer circuits and are thinner than existing organic materials, 3 at the same time, glass substrates have stronger heat resistance and photoelectric performance.
TGV(glass based) packaging technology has obvious advantages over traditional packaging, helping AI chips to develop in the direction of higher performance and lower power consumption. In addition, glass substrates can also be used for board level packaging, which is currently in the rapid expansion of production and is expected to promote the development of glass substrates.
The company's characteristic products are: glass based circuit board, IC seal loading board, HDI blind buried multi-layer circuit board, soft and hard combined board, especially in the field of glass based circuit board developed a multi-layer glass based circuit board. According to customer needs, we can customize all kinds of materials (ceramics, glass, graphite and other materials) and various special processes of circuit boards, can produce thin film thick film process, and can currently produce ultra-long and ultra-wide precision unconventional products with 2MIL minimum aperture and 2MIL line width and line distance. Products are widely used in semiconductor, communication, optoelectronics, automotive, industrial control and other electronic fields
Glass substrate
Recently, the company said that the supply chain for GB200DGXIMGX, the advanced packaging process used in the GB200, which will use glass substrates, has been started.
Glass substrates can form finer circuits and are thinner than existing organic materials, 3 at the same time, glass substrates have stronger heat resistance and photoelectric performance.
TGV(glass based) packaging technology has obvious advantages over traditional packaging, helping AI chips to develop in the direction of higher performance and lower power consumption. In addition, glass substrates can also be used for board level packaging, which is currently in the rapid expansion of production and is expected to promote the development of glass substrates.
The company's characteristic products are: glass based circuit board, IC seal loading board, HDI blind buried multi-layer circuit board, soft and hard combined board, especially in the field of glass based circuit board developed a multi-layer glass based circuit board. According to customer needs, we can customize all kinds of materials (ceramics, glass, graphite and other materials) and various special processes of circuit boards, can produce thin film thick film process, and can currently produce ultra-long and ultra-wide precision unconventional products with 2MIL minimum aperture and 2MIL line width and line distance. Products are widely used in semiconductor, communication, optoelectronics, automotive, industrial control and other electronic fields
