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Type/Product name/Application | High Density Interconnect PCB |
Material | Tg FR4\High-frequency material\Rogers\EMC\CEM-3\BT epoxy resin |
Surface Finishing | HASL\OSP\ENIG\GOLD Finger\Immersion Tin\HASL Lead Free |
Certificate | ISO9001/Iso14001/CE/ROHS/IATF16949 |
Testing Service | 100% AOI/Fly-probe/ICT/FCT/X-Ray Function Testing |
File | Gerber/Bom/AutoCAD's DXF/DWG/Eagle/CAM |
PCB Standard | IPC-A-600/IPC-A-610 D/IPC-III Standard |
Service | Turnkey Assembly PCBA Service |
Base Material | FR-4/CEM-1/CEM-3/FR1/aluminum |
Package | Vacuum Package/bubble Bag/ESD Package |
Min. Hole Size | 0.1mm |
Forming mode | Mechanical forming, film punching, mold forming |
HDI (High Density Interconnect) PCB is a printed circuit board with high density interconnect characteristics. It achieves higher signal transmission speed and smaller size than traditional PCBS through smaller apertures, thinner lines and higher level stacking. Key technologies for HDI PCBS include microholes (via), blind holes (via) and buried holes (buried via), which enable the board to accommodate more components, provide higher performance, and maintain a smaller volume.
Type/Product name/Application | High Density Interconnect PCB |
Material | Tg FR4\High-frequency material\Rogers\EMC\CEM-3\BT epoxy resin |
Surface Finishing | HASL\OSP\ENIG\GOLD Finger\Immersion Tin\HASL Lead Free |
Certificate | ISO9001/Iso14001/CE/ROHS/IATF16949 |
Testing Service | 100% AOI/Fly-probe/ICT/FCT/X-Ray Function Testing |
File | Gerber/Bom/AutoCAD's DXF/DWG/Eagle/CAM |
PCB Standard | IPC-A-600/IPC-A-610 D/IPC-III Standard |
Service | Turnkey Assembly PCBA Service |
Base Material | FR-4/CEM-1/CEM-3/FR1/aluminum |
Package | Vacuum Package/bubble Bag/ESD Package |
Min. Hole Size | 0.1mm |
Forming mode | Mechanical forming, film punching, mold forming |
HDI (High Density Interconnect) PCB is a printed circuit board with high density interconnect characteristics. It achieves higher signal transmission speed and smaller size than traditional PCBS through smaller apertures, thinner lines and higher level stacking. Key technologies for HDI PCBS include microholes (via), blind holes (via) and buried holes (buried via), which enable the board to accommodate more components, provide higher performance, and maintain a smaller volume.