  +86-147-3753-9269       purchases@ruomeipcba.com
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
Home » Products » HDI PCB » High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier

loading

High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier
High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier

High-Frequency Glass Substrate PCB PCBA Manufacture OEM/ODM Supplier

Availability:
Quantity:
Product Description
Type/Product name/ApplicationHigh Density Interconnect PCB
MaterialTg FR4\High-frequency material\Rogers\EMC\CEM-3\BT epoxy resin
Surface FinishingHASL\OSP\ENIG\GOLD Finger\Immersion Tin\HASL Lead Free
CertificateISO9001/Iso14001/CE/ROHS/IATF16949
Testing Service100% AOI/Fly-probe/ICT/FCT/X-Ray Function Testing
FileGerber/Bom/AutoCAD's DXF/DWG/Eagle/CAM
PCB StandardIPC-A-600/IPC-A-610 D/IPC-III Standard
ServiceTurnkey Assembly PCBA Service
Base MaterialFR-4/CEM-1/CEM-3/FR1/aluminum
PackageVacuum Package/bubble Bag/ESD Package
Min. Hole Size0.1mm
Forming modeMechanical forming, film punching, mold forming


HDI (High Density Interconnect) PCB is a printed circuit board with high density interconnect characteristics. It achieves higher signal transmission speed and smaller size than traditional PCBS through smaller apertures, thinner lines and higher level stacking. Key technologies for HDI PCBS include microholes (via), blind holes (via) and buried holes (buried via), which enable the board to accommodate more components, provide higher performance, and maintain a smaller volume.


facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
sharethis sharing button
Previous: 
Next: 

Quick Links

Follow Us

Payment partners

Contact Us

   +86 14737539269
   Optics Valley Dingchuang International ,East Lake High-Tech Development Zone , Wuhan
Copyright © 2023 Ruomei Electronic Co., Ltd. All Rights Reserved. Privacy Policy. Sitemap. Technology by leadong.com
Email ID :