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SMT(B/T)+Pressure Welding+DIP
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SMT(B/T)+Pressure Welding+DIP

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SMT(B/T)+Pressure Welding+DIP SMT(B/T)+Pressure Welding+DIP

SMT(B/T)+Pressure Welding+DIP

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Product Description

● Product size 250*320*3.0mm

● 18-Layers PCB

● Minimum component specification 0201

● Product process characteristics:

High speed connector need to do Pressure Welding; Board is thicker, use selective wave soldering plug-in, ensure that the penetration rate of plug-in tin 100%.


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