Quality control advantages: Professional device procurement team, device resource integration and optimization, improve the cost performance of components, formal material channels, to ensure efficient and stable product performance, delivery guarantee
Layers:1
Board Thickness：2.5mm
Product size：90*90mm
material:R1755V
Copper Thicknes:2OZ
Line/Space:4/5mil
Smallest Hole Diameter:1.8mil
Surface Finsh：ENIG
Parameters
Number of layers: multiple layers, the specific number of layers depends on the design requirements.
Base Material: Polyimide with excellent electrical and physical properties.
Plate thickness: According to design requirements, usually between 0.2mm and 2.2mm.
Copper foil thickness: ranging from 1OZ to several OZ to meet different current carrying requirements.
Minimum line width/line spacing: Provide fine circuit design based on process capabilities.
Minimum hole diameter: supports micro-hole processing and adapts to compact circuit layout.
Surface treatment: such as ENIG, Immersion Gold, Immersion Silver, etc. to improve welding performance and oxidation resistance.
