Layers: 12L
Product size: 200*310*3.2mm
Material: PI
Board Thicknes: 2 mm
Copper Thicknes: 35/18/18/35 um
Min.Trace/Space: 1.7/1.7mil
Min.Hole Size: 0.1mm
Surface Finsh: ENIG
Our company has the following advantages:
1. We can provide flexible production, from prototype to mass production.
2. We can support many types of products, such as Normal boards, Multilayer boards, High Speed boards, FPC, Rigid-Flex boards, HDI boards,SMT Assembly.
3. Since our company is located in the mainland of China, We can offer more competitive price.
4.You can contact our company website for more information about us
Applications
High-end smartphones: Used for high-density circuit connections in smartphones.
Computers and Servers: Motherboards and expansion cards used in high-performance computing equipment.
Medical Imaging Equipment: Provides complex circuit designs in medical scanners and imaging equipment.
Aerospace: High reliability circuit systems used in aerospace equipment.
