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Layers:4
Board Thickness：1mm
Product size：160*200mm
material:EM888
Copper Thicknes:1OZ
Line/Space:3/4mil
Smallest Hole Diameter:3.3mil
Surface Finsh：ENIG
Features
Flexible design: FPCB can be bent to a certain angle to adapt to the spatial layout of different products.
Customized services: Provide customized circuit design and component assembly according to customer needs.
Lightweight and portable: lighter than traditional hard board PCB, easy to carry and integrate into portable devices.
Diverse layer selection: supports single-layer, double-layer and even multi-layer flexible circuit board designs.
Fine wiring and space: Achieve fine wiring and compact space layout to accommodate small-sized electronic components.
Parameters
Base material: polyimide (PI) or other flexible materials.
Conductive layer: Copper foil, available in different thickness options.
Temperature resistance: Able to withstand a certain temperature range and adapt to different working environments.
Size: Customized size according to customer needs.
Insulation layer: a material with good insulation properties to ensure circuit safety.
The storage period of PCB is mainly distinguished by surface treatment.
HAL, LF-HAL, Immersion Gold or ENIG surface process: shelf life 1 year
OSP, Immersion Silver, Immersion Sn: shelf life 6 months
Storage conditions: temperature 20-28 ℃, humidity ≤80%, vacuum packaging
Layers:4
Board Thickness：1mm
Product size：160*200mm
material:EM888
Copper Thicknes:1OZ
Line/Space:3/4mil
Smallest Hole Diameter:3.3mil
Surface Finsh：ENIG
Features
Flexible design: FPCB can be bent to a certain angle to adapt to the spatial layout of different products.
Customized services: Provide customized circuit design and component assembly according to customer needs.
Lightweight and portable: lighter than traditional hard board PCB, easy to carry and integrate into portable devices.
Diverse layer selection: supports single-layer, double-layer and even multi-layer flexible circuit board designs.
Fine wiring and space: Achieve fine wiring and compact space layout to accommodate small-sized electronic components.
Parameters
Base material: polyimide (PI) or other flexible materials.
Conductive layer: Copper foil, available in different thickness options.
Temperature resistance: Able to withstand a certain temperature range and adapt to different working environments.
Size: Customized size according to customer needs.
Insulation layer: a material with good insulation properties to ensure circuit safety.
The storage period of PCB is mainly distinguished by surface treatment.
HAL, LF-HAL, Immersion Gold or ENIG surface process: shelf life 1 year
OSP, Immersion Silver, Immersion Sn: shelf life 6 months
Storage conditions: temperature 20-28 ℃, humidity ≤80%, vacuum packaging
