Layers:18
Board Thickness:2.6mm
Product size：100*220mm
material:S1190
Copper Thicknes:1OZ
Line/Space:3/4mil
Smallest Hole Diameter:2.5mil
Surface Finsh：ENIG
About the baking parameter requirements before our SMT patch: the temperature is 120±5℃, generally baking for 2 hours.
1. If the manufacturing date is within 2 months and the sealing is unsealed for more than 5 days, the temperature is 120±5℃ and baked for 1 hour.
2. The manufacturing date is 2 to 6 months, and the temperature is 120±5 ° C for 2 hours.
3. The date of manufacture is 6 months to 1 year, and the temperature is 120±5 ° C for 4 hours.
4. The baked circuit board must be completed within 5 days, and the unprocessed board needs to be baked for another 1 hour
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