Multilayer Prototype PCB Development Board for Electronic Board Makers And Prototypes

Layers:32

Board Thickness：2.8mm

Product size：70*80mm

material:RO4003C

Copper Thicknes:2OZ

Line/Space:4/5mil

Smallest Hole Diameter:2.9mil

Surface Finsh：ENEPIG

Multi-layer design: 32-layer complex design, suitable for high-performance and high-density circuit requirements.

Precise manufacturing: the minimum line width/line spacing is 4/5mil, ensuring the accuracy and reliability of the circuit.

HIGH QUALITY MATERIAL: Use RO4003C material to ensure the performance and durability of the circuit board.

International certification: It has quality management system certifications such as ISO9001, IATF16949, ISO13485, and UL certification.

Surface treatment: ENEPIG surface treatment, providing good oxidation resistance and welding performance.

In terms of quality, we have: ISO9001 quality management system, ATF16949 global quality management system standard for the automotive industry, ISO13485 medical device quality management system, UL certification: mainly for the certification of materials, products exported abroad generally need to add UL marks

Requirements: The temperature is 120±5℃, generally baked for 2 hours, starting from the time the temperature reaches the baking temperature.

Temperature and time:

1. For the sealed and unsealed products with a manufacturing date within 2 months and more than 5 days, bake at 120±5℃ for 1 hour.

2. For the manufacturing date between 2 and 6 months, bake at 120±5℃ for 2 hours.

3. For the manufacturing date between 6 months and 1 year, bake at 120±5℃ for 4 hours.

4. The baked circuit board must be mounted within 5 days, and the unfinished ones need to be baked for another hour

before they can be put on the machine.