Layers:28
Board Thickness：3.4mm
Product size：60*70mm
material:RO4850
Copper Thicknes:1OZ
Line/Space:3/4mil
Smallest Hole Diameter:2mil
Surface Finsh：ENIG
We provide one-stop service to meet customer needs, from structural analysis and design, hardware analysis and design, software design, simulation test, device, test analysis to product BOM, program risk identification list, key component list, test equipment requirements, programs, test standards and programs. Then to Layout, PCB manufacturing, SMT mounting, DIP plug-in assembly, general device procurement. Finally, hardware and software tests are carried out.
