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Layers: 24L
Product size: 350*4000*2.2mm
Material: FR-4 TG140
Board Thicknes: 2.4 mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 4/4mil
Smallest Hole Diameter: 0.15mm
Surface Finsh: ENIG
Conduct comprehensive testing and calculation of the thickness, area, volume, etc. of printed solder paste 2. 100% inspection and judgment of printing solder paste quality, such as low tin, pinching, short circuits, etc
Layers: 24L
Product size: 350*4000*2.2mm
Material: FR-4 TG140
Board Thicknes: 2.4 mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 4/4mil
Smallest Hole Diameter: 0.15mm
Surface Finsh: ENIG
Conduct comprehensive testing and calculation of the thickness, area, volume, etc. of printed solder paste 2. 100% inspection and judgment of printing solder paste quality, such as low tin, pinching, short circuits, etc