Layers: 2L
Product size: 500*660*2.4mm
Material: TU-872HF
Board Thicknes: 1mm
Copper Thicknes: 1.4mm±0.1mm
Line/Space: 2.7/2.7mil
Smallest Hole Diameter: 0.16mm
Surface Finsh: ENIG
DIP Mass Production Line (Wave Soldering) Equipment track width adjustment: 510mm Production Max welding temperature: 330 ℃ PCB transmission speed: 0.2~10m/min PCB positioning accuracy: ± 0.2mm Welding positioning accuracy: ± 0.15mm Heating time of tin furnace: 75min (temperature 280 ℃)
