The PCB Board Mainly Consists of

PCB board is mainly composed 

copper foil, core board, PP three raw materials

Copper foil: Main thickness: 1/3OZ, 1/2OZ, 1OZ

Core board (Core) : the Chinese name can be called core board, copper clad plate, substrate, used to do the inner layer graphics or double panels, it is composed of copper foil + insulation layer + copper thin, the middle insulation layer is already cured resin and glass cloth composition; Core can also be made by pressing two sheets of copper foil +PP through high temperature and pressure. Has a certain hardness and thickness, and double bread copper.

Copper foil requirements: Purity: (Purity) electrolytic copper foil needs to be higher than 99.8%, rolled copper foil needs to be higher than 99.9%. Main thickness: 1/3OZ, 1/2OZ, 1OZ, 2OZ, 3OZ, 4OZ.

                              Core board composition diagram

PP: Prepreg is the English abbreviation of Pre-impregnate, and the Chinese name is semi-cured sheet, which is a sheet bonding material synthesized by resin and carrier. When pressed through high temperature and high pressure, PP will dissolve and then bond two Core or copper foil to form a multi-layer board, which is also understood as a semi-cured glue attached to the glass cloth. Composed of resin and glass fiber cloth, glass cloth is a number of inorganic substances after high temperature fusion cooling into an amorphous state of hard objects, and then by the warp, weft interwoven to form a reinforcing material. According to the types of glass cloth can be divided into 106, 1080, 3313, 2116, 7628 and other several. Resin is a thermosetting material that can undergo polymeric polymerization and can be used as an adhesive between copper foil and reinforcement (glass fiber cloth). According to the crosslinking status of the resin can be divided into :A (completely uncured); Stage B (semi-cured); Class C (fully cured) Class 3, all P/P used in production is class B state. The following is a diagram of a common six-layer board:

                                                 Third order buried hole HDI section

PCB classification

☆. According to the level

a. Single panel; b. Dual panel; c. Multi-layer board;

☆. To the finished product soft and hard distinction

a. Hard board b. Soft board c. Soft and hard board

☆ Divided by product structure

a. Common multi-layer board B. DI board c. Mechanical blind buried hole board

☆ Divided by product use

a. Goldfinger card; b. Communication system board (system board, backplane, system HDI board);

c, IC carrier board d. high frequency, high speed board; e, other consumer electronic products (such as mobile phone board, computer motherboard, power board, metal substrate, etc.)

From the perspective of output value distribution, PCB is mainly composed of flexible board, multi-layer board, HDI board and IC package substrate, which account for the largest proportion of four categories of products.

Flexible plate

Also known as flexible board, it is a printed circuit board made of flexible insulating substrates such as polyimide or polyester film. The flexible board can be bent, wound, folded, arranged according to the spatial layout requirements, and moved and expanded in three-dimensional space, so as to achieve the integration of component assembly and wire connection, and facilitate the assembly of electrical components.

Multilayer board

Is a printed circuit board with four or more layers of conductive graphics. In order to increase the area that can be wired, the multilayer board uses more single or double sided wiring boards. The multi-layer plate uses several double panels, and a layer of insulation (semi-cured sheet) is placed between each layer of plates and glued. In order to extract the printed wires sandwiched in the middle of the insulating substrate, the holes (i.e. pilot holes) of the mounting components on the multilayer board are metallized to connect them to the printed wires sandwiched in the insulating substrate.

Multilayer board is a circuit board with four or more layers of circuits, which is made of multiple single or double panels pressed together, through the secondary drilling hole metallization can form more complex and higher density circuit information between different layers of circuit boards. Multi-layer board can be divided into 4-6 layers, 8-16 layers, 18 layers and more circuit boards, communication equipment, network equipment, computers, servers are mainly used for more than 10 layers of the board, automotive, home appliances, industrial control, medical equipment and other board layers are mainly 4-18 layers. At present, the market is mainly based on 4-16 layers of low-rise boards, but the demand for 18 layers and above high-rise circuit boards is growing rapidly.

HDI

It is short for High Density Interconnect technology. HDI board is the consistent name of Japanese companies for high-density interconnected printed circuit boards, and in Europe and the United States, HDI board is called "microporous board". HDI is a kind of PCB technology, and it is a method for making high-precision circuit boards with the development of electronic technology, which can achieve high-density wiring, and is generally manufactured by stacking method. HDI uses the conventional multi-layer board as the core board, and then superimpose the insulation layer and the line layer (that is, the "stacking") layer by layer, and uses the laser drilling technology to drill holes on the stacking layer, so that the whole printed circuit board forms the interlayer connection with buried and blind holes as the main conduction mode

Compared with the mechanical drilling of ordinary multilayer boards, HDI boards use laser blind hole technology to achieve a smaller aperture (< 0.15mm) and a narrower line width and line distance (40-50μm). By burying blind holes between the different layers, the connectivity between the different layers of the HDI board is further improved to achieve more complex, fine and high-density circuit information transmission, with a wiring density of more than 117 inches per square inch. Due to its high density, HDI boards are mainly used in consumer electronics that require compact, lightweight, and strong mobility.

HDI board usually has 4-16 layers between the number of layers, according to the number of laser drilling and the number of layers can be divided into first order, second order, third order, fourth order, Anylayer HDI and other different types. The order of HDI is defined as (n-1) order from the center layer to the outermost layer if N layers are continuously routed through a blind hole. On top of this, if each layer of circuits are laser drilled between each other to achieve any layer interconnection, it belongs to Anylayer HDI technology, which can achieve more complex and high-density circuits.

HDI board production process relative to the traditional PCB production process can reduce the cost, when the PCB density exceeds eight layers of board, HDI board to manufacture the cost is lower, and can reduce radio frequency interference (RFI), electromagnetic interference (EMI), electrostatic discharge (ESD) by realizing AnyLayer, and improve the design efficiency

IC Package Substrate

Also known as IC sealing board, packaging substrate is the key carrier of integrated circuit industry chain sealing link, at present, IC packaging substrate is usually made of traditional multilayer board or HDI board as the basis, to provide electrical connection (transition) between the chip and the printed circuit board, while providing protection, support, heat dissipation channel for the chip. As well as the effectiveness of meeting the standard mounting size, it can even be embedded in passive and active devices to achieve certain system functions.

Copper-clad plate

The full name of Copper Clad Laminate (CCL) is the basic material of the electronics industry for the manufacture of printed circuit boards (PCBS). It is made of a reinforced material such as fiberglass cloth impregnated with resin and covered with copper foil on one or both sides by hot pressing. Copper clad plate is widely used in the electronics industry, such as automotive electronics, communication equipment, industrial control and so on. China is an important market for copper clad panels, with sales expected to exceed 950 million square meters and sales of about 82.7 billion yuan in 2021. According to the substrate, the main types are glass fiber cloth base, metal base (such as aluminum substrate) and ceramic copper clad plate, each has different performance characteristics, such as aluminum substrate has excellent thermal conductivity. With the development of science and technology, the demand for high-performance copper clad plates has increased, and the industry is moving toward technological innovation and product upgrading.

PCB board

Industry increment of PCB for automotive electronics

The popularity of automotive electronics will promote the volume and price of automotive PCB(printed circuit board). In recent years, the trend of automobile electrification and electronization is obvious, and PCB is almost everywhere in automotive electronic systems.

The PCB consumption of new energy vehicles is close to 4 times that of traditional fuel vehicles, and the PCB price of a bicycle is more than 1,200 yuan. At present, the on-board chargers, DC-DC converters, inverters and battery management systems dedicated to new energy vehicles need to apply a large number of PCBS. The penetration rate and total amount of domestic new energy vehicles are in the forefront of the world, and the high growth rate will be maintained in the next few years, and the relevant PCB suppliers will benefit significantly.

Smart driving components such as millimeter wave radar will boost demand for high-end PCBS. Due to the circuit frequency of up to 24\77GHz, the requirements for the material, dielectric properties and accuracy of PCB and upstream copper-clad plate are much higher than ordinary PCB, making the unit price of PCB used is 3 to 10 times that of ordinary board. With the continuous penetration of intelligent driving equipment, the market for high-end PCB will usher in an explosion.