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Layers: 14L
Product size: 470*550*2.4mm
Material: PI
Board Thicknes: 1.6mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 2.2/2.2mil
Smallest Hole Diameter: 0.17mm
Surface Finsh: ENIG
In the fields of AC/DC power modules and memory, IoT/communication modules, and crystals/oscillators/resonators, there are close cooperation relationships and high matching, which are quite guaranteed in terms of price and delivery.
Layers: 14L
Product size: 470*550*2.4mm
Material: PI
Board Thicknes: 1.6mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 2.2/2.2mil
Smallest Hole Diameter: 0.17mm
Surface Finsh: ENIG
In the fields of AC/DC power modules and memory, IoT/communication modules, and crystals/oscillators/resonators, there are close cooperation relationships and high matching, which are quite guaranteed in terms of price and delivery.