Layers: 18L
Product size: 520*590*3.0mm
Material: TU-883
Board Thicknes: 1.8mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 1.9/1.9mil
Smallest Hole Diameter: 0.14mm
Surface Finsh: ENIG
SMT Mass Production Line
Min PCB size for production: 50 * 50mm
Max PCB size for production: 910 * 600mm
Min component size for equipment mounting:01005
Machine mounting accuracy: ± 0.02mm
Min pitch (IC type) components for equipmentinstallation: 0.15mm
Min pitch (BGA type) component for equipmentinstallation: 0.2mm
